PCBALU201L Schneider Relay Module
As a printed circuit board assembly product, it may integrate various electronic components such as resistors, capacitors, inductors, transistors, integrated circuits, etc. to achieve specific circuit functions; The substrate may be made of materials such as FR-4, CEM-1, aluminum substrate, etc., which have different mechanical strength, electrical properties, heat resistance, and moisture resistance, and are suitable for different application scenarios; During the manufacturing process, surface mount technology (SMT) and through-hole insertion technology (THT) may be used to ensure precise installation and soldering quality of components; At the same time, it may be equipped with complete welding materials and auxiliary materials, such as solder, solder paste, flux, insulation materials, heat dissipation materials, etc., to enhance the reliability and performance of the product; In addition, the product may follow strict quality control processes, including SPI testing, AOI testing, X-RAY testing, ICT online testing, and FCT functional testing, to ensure that the quality of each PCBA board meets design requirements.
Technical specifcations for PCBALU201L
Circuit board specifications:
Layers: Supports multi-layer board design, such as 1-40 layers
Plate thickness: covering the range of 0.2mm to 8.0mm to meet the requirements of different mechanical strength and electrical performance.
Copper thickness: Provides copper thickness options from 0.5oz to 12oz to accommodate different current carrying and heat dissipation needs.
Minimum line width/gap: may reach 2.5mil/2.5mil or finer to support high-density wiring.
Electrical performance:
Impedance control: Capable of controlling impedance tolerances of ± 5% or ± 10% to ensure signal integrity.
Electrical strength: May meet specific electrical strength requirements, such as 30KV/mm or higher.
Insulation resistance: may have a high insulation resistance value to ensure electrical isolation between circuits.
Material selection:
Basic materials: FR-4, high Tg materials, halogen-free materials, ceramic substrates, etc. may be used to meet different requirements for heat resistance, environmental friendliness, and mechanical properties.
Surface treatment: may provide HASL, immersion in gold/silver/tin OSP, Various surface treatment options such as hard gold plating are available to enhance welding performance and corrosion resistance.
Manufacturing process:
Drilling capability: Supports a minimum mechanical drilling aperture of 0.15mm and a laser drilling aperture of 4mil.
Circuit fabrication: high-precision circuit fabrication processes such as LDI (Laser Direct Imaging) technology are used to ensure circuit accuracy.
Quality control: Following strict quality control processes, including AOI testing, X-RAY testing, electrical testing, etc., to ensure product quality.
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Our Services:
1,All our products are new and orginal, and of good quality
2,Our prices are very competitive.
3, We have a large quantity in stock, so we could help the customers to get the components which are dificult to get.
4,All inquiries will be valued and will reply in 24.
Packing & Delivery:
1,100% brand New and Original Factory Seal!
2,Warranty:1 year
3,Package: Original packing with cartons.
4,Delivery time: Shipped in 3-7 days after payment
5,All the goods will be tested before shipment
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